http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006152185-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2a31fcc612113c3e0133010da71ca83 |
| publicationDate | 2006-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006152185-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in high fluidity, low warpage and solder resistance, and particularly suitable for area mounting type semiconductor encapsulation, and a semiconductor device using the same. SOLUTION: The crystalline epoxy resin (A), the phenol resin (B) represented by the general formula (1), the curing accelerator (C), and 85 to 95% by weight of the inorganic based on the total epoxy resin composition. An area mounting type semiconductor sealing epoxy resin composition comprising a filler (D) as a main component and the epoxidized polybutadiene compound (E) in an amount of 0.05 to 5% by weight in the total epoxy resin composition; Area mounting in which a semiconductor element is mounted on one surface of a substrate, and substantially only one surface on the substrate surface side on which the semiconductor element is mounted is sealed using the above-described area mounting type semiconductor sealing epoxy resin composition Type semiconductor device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016183258-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019014843-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012167215-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019196473-A |
| priorityDate | 2004-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.