http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006124419-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2004-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82ef3ceca090e7dc42db25e360025571 |
| publicationDate | 2006-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006124419-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and is excellent in flame retardancy, high temperature storage characteristics and moisture resistance reliability. (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) aluminum hydroxide, (E) an inorganic filler excluding the aluminum hydroxide as an essential component, and the hydroxylation Aluminum is aluminum hydroxide that has been washed with warm pure water, and the total amount of Na 2 O contained in the aluminum hydroxide is 0.1% by weight or less, and the amount of hot water extracted Na 2 O is 0.03% by weight or less. An epoxy resin composition for encapsulating a semiconductor, characterized in that |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008143950-A |
| priorityDate | 2004-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.