| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent moldability, flame retardancy, high-temperature storage characteristics, and solder crack resistance. To do. (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an inorganic filler, and (E) of aluminum hydroxide as an essential component, Na 2 contained in the aluminum hydroxide An epoxy resin composition for semiconductor encapsulation, wherein O is 0.1% by weight or less. |