| abstract |
A method and apparatus for removing material from a substrate surface, such as an IC component. Power is applied to an electrode 12a in the chamber 10 to generate plasma in the vacuum chamber, and a surface 24 of the substrate 22 is brought into contact with one or more of plasma ions, atoms or free radicals. . The power, preferably DC, is supplied from the power supply 14 as a variable voltage, preferably as a pulsed voltage, to avoid arcing. [Selection] Figure 1 |