| abstract |
PROBLEM TO BE SOLVED: To provide a plated wiring forming method capable of obtaining high adhesion between a substrate and wiring while forming wiring by selective plating. A method of the present invention is a method of forming a wiring by selectively plating a conductor on a resin substrate, wherein an ozone water treatment step of bringing ozone water into contact with the surface of the substrate; An exposure process for selectively irradiating the surface with light, an alkali treatment process for contacting the surface of the substrate with an alkali treatment liquid, a catalyst application process for applying a plating catalyst to the surface of the substrate, and an electroless conductor on the surface of the substrate And an electroless plating step of plating. [Selection] Figure 1 |