| abstract |
PROBLEM TO BE SOLVED: To provide a conductive ink composition whose adhesion with an object to be coated is improved as compared with the prior art. Moreover, the conductive ink composition which can suppress the metal grain growth and can form the film | membrane excellent in surface smoothness is provided. A conductive ink composition is obtained by dispersing a solid material obtained by coating the surface of metal fine particles made of an alloy containing at least a noble metal with a protective colloid made of at least two organic compounds in an organic solvent. As the protective colloid, for example, a protective colloid obtained from a raw material containing (A) amines and (B) carboxylic acid is used. By applying and baking the conductive ink composition, it is possible to obtain a metal film in which grain growth is suppressed, surface smoothness is excellent, and adhesion with an object to be applied is improved as compared with the conventional case. [Selection] Figure 1 |