| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2786295e61d306bf527292c8aea9ff7a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J153-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2004-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b6bd46f8092f2ef954bd2e91e7ff35a |
| publicationDate |
2006-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006028242-A |
| titleOfInvention |
Adhesive tape for electronic parts and electronic parts |
| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive tape for electronic parts which is excellent in wire bonding property when attached to a lead pin and can improve the reliability of a semiconductor device obtained. Furthermore, the electronic component which has the adhesive tape for electronic components is provided. The adhesive tape for electronic parts of the present invention has a support film and an adhesive layer, and the stiffness value of the support film is 0.06 mN or more. The electronic component of the present invention has the above-described adhesive tape for electronic components attached thereto. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102047398-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102047398-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008095014-A |
| priorityDate |
2004-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |