| abstract |
An adhesive for electronic parts that can be bonded and cured at a relatively low temperature and has sufficient heat resistance and reliability, and an adhesive tape for electronic parts using the same. An adhesive layer made of the above adhesive is laminated on at least one surface of an adhesive for electronic parts containing the following component (A), component (B) and component (C), and a heat resistant film. Adhesive tape for electronic parts. Component (A): Compound having two or more maleimide groups, Component (B): Styrenic block copolymer, Component (C): General formula (1) H 2 N-R 1 -NH 2 (1) (Wherein R 1 represents a divalent aliphatic group, aromatic group or alicyclic group) and a diamine compound represented by the general formula (2) [Chemical 1] (Wherein R 2 represents a divalent aliphatic group, aromatic group, or alicyclic group, and n represents an integer of 0 to 7), and from a polysiloxane compound having amino groups at both ends. At least one selected [selection figure] None |