| abstract |
PROBLEM TO BE SOLVED: To provide a product and assembly for socket-receiving an elongated interconnection element such as a spring contact element extending from an electronic component such as a semiconductor device. The socket substrate is provided with a capture pad for receiving an end of an elongated interconnect element extending from the electronic component. Various capture pad configurations are disclosed. A fixing device such as a housing securely positions the electronic component relative to the socket substrate. Connection to the external device is provided through conductive traces adjacent to the surface of the socket substrate. The socket substrate can be supported by a support substrate. In a particularly preferred embodiment, the capture pad is formed directly on a primary substrate such as a printed circuit board. [Selection] Figure 5 |