| abstract |
PROBLEM TO BE SOLVED: To provide a product and an assembly for socketally receiving an elongated interconnect element such as a spring contact element extending from an electronic component such as a semiconductor device. The socket substrate includes a capture pad for receiving an end of an elongated interconnect element extending from an electronic component. Various capture pad configurations are disclosed. A securing device, such as a housing, securely positions the electronic component with respect to the socket substrate. Connections to external devices are provided through conductive traces adjacent the surface of the socket substrate. The socket board can be supported by the support board. In a particularly preferred embodiment, the capture pads are formed directly on a primary substrate, such as a printed circuit board. |