http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005535140-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-0076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28D5-00 |
| filingDate | 2003-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2005-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005535140-A |
| titleOfInvention | Packaged semiconductor device manufacturing method and apparatus, packaged semiconductor device obtained by such method, and metal carrier suitable for use in such method |
| abstract | The present invention relates to a method for manufacturing a packaged semiconductor device, in which a metal carrier including at least one semiconductor crystal to which a sealing material is applied is subjected to an individualization process in a dicing apparatus including a dicing blade (5) G including diamond grains In the individualization process, the dicing blade cuts the encapsulant and the metal carrier (100) to individualize the at least one semiconductor device while being cooled with the cooling fluid, and the friction force is applied during the individualization process. Use a cooling fluid to reduce Preferably, a sintered metal dicing blade (5) comprising sharp cleaved diamond grains is used, wherein the sharp cleaved diamond grains are sawed so that the distance between the diamond grains contributing to the cutting is substantially all ( It is used in the dicing blade (5) at a density lower than or equal to the maximum density defined at a density that is long enough to allow removal of the (cutting) debris. The metal carrier (100) preferably comprises various features that reduce the amount of metal to be cut and prevent metal vibration during cutting. |
| priorityDate | 2002-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.