| abstract |
The present invention relates to a method for creating copy protection for integrated circuits. It is an object of the present invention to provide effective and reliable copy protection to prevent unauthorized duplication of integrated circuits. The present invention provides a substrate (1) having a semiconductor structure (2) on at least a first side (1a), a material (23) for coating the substrate (1), Coating the substrate (1) with a copy protection layer (4). It has been found to be particularly advantageous that the copy protection layer (4) is produced by applying silicate glass by vapor deposition coating. This is because the etching process that dissolves the copy protection layer also erodes the substrate (1) to at least partially destroy the semiconductor structure (2). |