| abstract |
A colloidal suspension of nanoparticles composed of a dense material dispersed in a solvent is used to form a gap-fill dielectric material with low thermal shrinkage. Dielectric materials are particularly useful for pre-metallized dielectric and shallow trench isolation applications. According to the method of forming a dielectric material, a colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The interlayer is infiltrated with a liquid phase matrix material such as a spin-coated polymer and subsequently cured, or it is infiltrated with a gas phase matrix material and subsequently cured, or modified only by curing, gap filling properties A thermally stable, etch resistant dielectric material is provided. |