| abstract |
An object of the present invention is to provide a polishing pad capable of transmitting end point detection light on a polishing surface of a semiconductor wafer without deteriorating polishing performance, and a method for manufacturing the same. A polishing substrate having a polishing surface and a translucent portion fused to the polishing substrate, and the translucent member is cut along a plane parallel to the polishing surface. A chemical mechanical polishing pad 1 whose cross-sectional shape is an elliptical shape with a value obtained by dividing a major axis by a minor axis exceeding 1. [Selection] Figure 5 |