http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005302899-A

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filingDate 2004-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2005-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005302899-A
titleOfInvention Method for forming thin film pattern and method for forming magnetoresistive element
abstract PROBLEM TO BE SOLVED: To provide a thin film pattern forming method capable of forming a thin film pattern having a minute dimension with higher accuracy. SOLUTION: Since a soluble layer 2 that continuously covers the entire periphery of the two-layer resist pattern 5 and the entire first thin film 17Z in a region other than the region covered by the two-layer resist pattern 5 is formed. It is possible to suppress the deformation of the two-layer resist pattern 5 during dry etching, and to reduce the amount of reattachment 9 attached. Therefore, the isolated first thin film pattern 17 having a minute dimension and defined by the contour 7 can be formed with higher accuracy. Further, after forming the first thin film pattern 17 by dry etching, the two-layer resist pattern 5 covered with the soluble layer 2 is formed using a solvent capable of dissolving both the two-layer resist pattern 5 and the soluble layer 2. Since it is removed, the first thin film pattern 17 and the two-layer resist pattern 5 can be separated without any trouble. [Selection] Figure 5
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