http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005256119-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_013d996a4f6fa0f576767d6ad3926786
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B5-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
filingDate 2004-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38644c7045d08a283076826886b028b5
publicationDate 2005-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005256119-A
titleOfInvention Deposition equipment
abstract PROBLEM TO BE SOLVED: To provide a film forming apparatus capable of controlling the thickness of a film deposited on a substrate having an uneven surface. In a film forming apparatus for forming a thin film of a material of the target on a substrate by sputtering the targets, an etching source is provided for etching the thin film. [Selection] Figure 3
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008076844-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013539498-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8665520-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009513983-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9290839-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009091603-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112981331-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8795477-B2
priorityDate 2004-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 24.