| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S156-914
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S156-916 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-5096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32495 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J19-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B25-08 |
| filingDate |
2004-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f71078e27a81662582c068c2ec727f7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a23d40886272f6c4100f71c863ef8844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eee14016755ed38cedb16939694a43e |
| publicationDate |
2005-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005191537-A |
| titleOfInvention |
Method and apparatus for protecting conductive surfaces in a plasma processing reactor |
| abstract |
PROBLEM TO BE SOLVED: To prevent formation of deposits on a surface of a chamber housing. A processing chamber in which a processing plasma is generated adjacent to a substrate 215 held on a substrate holder 216, and self-standing electrically insulating liners 220 to 223 face the processing plasma. It is arranged adjacent to the metal wall 212 of the processing chamber. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019505998-A |
| priorityDate |
1993-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |