| abstract |
To provide a microetching agent for copper and copper alloy capable of roughening the surface of copper and copper alloy. The following components (A) to (D): (A) Compound selected from the group consisting of sulfuric acid, alkane sulfonic acid and alkanol sulfonic acid and their derivatives (B) Peroxide (C) Compound selected from the group consisting of tetrazole and their derivatives (D) Copper It is a microetching agent for copper and copper alloy, characterized in that it contains a metal ion having a noble potential. [Selection figure] None |