http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004003020-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86dc9c9f208867a10f82d3b99e58a4b6 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| filingDate | 2003-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6131fa9cc2c1a812774b28de0e25aa8f |
| publicationDate | 2004-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004003020-A |
| titleOfInvention | Microetching agent for copper and copper alloy and method for finely roughening copper or copper alloy using the same |
| abstract | A microetching agent for copper and copper alloy capable of roughening the surface of copper and copper alloy, and a method for finely roughening copper or copper alloy using the same. The following components (A) to (D): (A) a compound selected from the group consisting of sulfuric acid, alkanesulfonic acid and alkanolsulfonic acid and their derivatives (B) a peroxide (C) a compound selected from the group consisting of tetrazole and their derivatives (D) copper Metal ions having a higher potential than the above (excluding silver ions when component (A) is sulfuric acid) And a microetching method for copper or copper alloy using the same. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101157412-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112708423-A |
| priorityDate | 2000-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 71.