http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005162570-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8aa118fbfa85a6e0cc8c13a8afca19ab
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-24
filingDate 2003-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50879c888f5d153ff14bd3c9131b757c
publicationDate 2005-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005162570-A
titleOfInvention Composite material for sealing
abstract Provided is a composite material for sealing which does not substantially contain a lead component for reducing environmental load and is excellent in required low expansion characteristics, weather resistance, fluidity, and the like. A lead-free glass powder and a filler powder, wherein the filler powder contains KZr 2 (PO 4 ) 3 filler powder and / or K 0.5 Nb 0.5 Zr 1.5 (PO 4 ) 3 filler powder. To do. Examples of the phosphoric acid-based lead-free glass powder include SnO 30 to 70%, P 2 O 5 20 to 45%, ZnO 0 to 20%, Al 2 O 3 0 to 10%, SiO 2 0 to 15% in terms of mol%. uses a glass containing B 2 O 3 0~30%. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014024710-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5839129-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105764847-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015076175-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6052428-B2
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priorityDate 2003-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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