| abstract |
An object of the present invention is to provide a method for manufacturing a wiring and a method for manufacturing a semiconductor device that do not require a photolithography process when connecting an upper layer pattern and a lower layer pattern. A wiring manufacturing method according to the present invention includes a step of locally ejecting a composition containing a conductive material on a first pattern to form a conductor functioning as a pillar, and the conductor covers the first pattern. Forming an insulator so as to be exposed, etching the insulator so that a part of the conductor is exposed, and forming a second pattern on the exposed conductor. It is characterized by. [Selection] Figure 1 |