| abstract |
To provide an epoxy resin composition for semiconductor encapsulation having low moisture permeability and excellent reliability and less warpage. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components, wherein the inorganic resin is used as an inorganic filler in PCT extraction water. An epoxy for semiconductor encapsulation, comprising a porous inorganic filler having an SO 4 ion content of 200 ppm or less, wherein the amount of the porous inorganic filler is 1 to 80% by weight based on the entire epoxy resin composition Resin composition. |