| abstract |
A highly conductive circuit pattern is formed on a substrate, and a conductive layer of the conductive circuit pattern can be satisfactorily formed. An object is to provide a substrate and a multilayer wiring substrate. A wiring board includes a base material, a non-conductive metal-containing resin layer that is selectively formed on the base material, and a conductive material that is formed on the metal-containing resin layer. The conductive metal layer 13 and the resin layer 14 selectively formed on the substrate 11 are configured. Before the metal-containing resin layer 12 is plated, the surface of the metal-containing resin layer 12 is subjected to an etching process, and a process of projecting at least a part of the conductive metal particles 20b on the surface of the metal-containing resin layer 12 is performed. As a result, the metal particles 20b contained in the metal-containing resin layer 12 serve as the core of electroless plating and have a catalytic effect on the progress of the plating reaction. [Selection] Figure 1 |