| abstract |
[PROBLEMS] To provide dielectric properties suitable for use in a high frequency band when thermoformed, excellent in flame retardancy, high solder heat resistance, low coefficient of linear expansion, and further to adhesion or adhesion to a metal layer. Provided are a crosslinkable resin composition and a crosslinkable molded article that are improved. Also provided are a flame retardant crosslinked molded article and a metal-clad substrate for a flame retardant printed wiring board using the crosslinkable resin composition. SOLUTION: To 100 parts by mass of a cyclic olefin resin (A), 0.3 to 2.5 parts by mass of an organic peroxide (B), 7 to 30 parts by mass of a crosslinking aid (C), and powdered red A crosslinkable resin composition in which 1 to 20 parts by mass of phosphorus (D) is dispersed and the blending ratio (C / B) of the organic peroxide (B) and the crosslinking aid (C) is 11 or more. It is. This is molded to obtain a crosslinkable resin molded product, and is further subjected to heat crosslinking to obtain a flame retardant crosslinked resin molded product. [Selection figure] None |