| abstract |
An object of the present invention is to provide a thermocompression adhesive and an adhesive film that are soluble in a solvent, have good heat resistance, have flexibility, and have low dielectric properties. An adhesive comprising an organic solvent solution containing a polyimide having a repeating unit represented by the following general formula. (R is a tetravalent group derived from cyclohexane, Φ is a group composed of a divalent aliphatic group having 2 to 39 carbon atoms, an aromatic group, or a combination thereof. -O -, - SO 2 -, - CO -, - CH 2 -, - C (CH 3) 2 -, - OSi (CH 3) 2 -, - C 2 H 4 0-, and, from -S- At least one group selected from the group consisting of [Selection figure] None |