| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 |
| filingDate |
1999-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f76ed5b52a4a67c1897ffbef5e811a4e |
| publicationDate |
2000-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000236167-A |
| titleOfInvention |
Wiring board, method for manufacturing the same, and transfer master used for manufacturing the wiring board |
| abstract |
[PROBLEMS] To improve the insulation reliability of a wiring board using an insulating resin layer formed from an electrodeposition film forming liquid. A wiring board having at least one conductive layer formed on a substrate, wherein an insulating resin layer formed using an electrodeposition film is provided between the substrate and the conductive layer. The electrodeposition film is provided between a conductive layer and another conductive layer and at least one site selected from the surface of the conductive layer, and the electrodeposition film comprises (A) an organic solvent-soluble polyimide and (B) A wiring board comprising a hydrophilic polymer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007335448-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4678138-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7246435-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7420130-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004359941-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8178791-B2 |
| priorityDate |
1998-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |