http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004349315-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762
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filingDate 2003-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8a72529843b91345c0b8ad5f614d88f
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publicationDate 2004-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004349315-A
titleOfInvention Method for manufacturing strained SOI substrate wafer
abstract Provided is a method for manufacturing a strained silicon substrate wafer having a SiC epitaxial layer that can form a high-quality strained Si layer, has fewer dislocations, and has a strain relaxed. A step of forming a porous silicon layer on a surface layer of a P + -type silicon substrate doped with high-concentration boron as a transfer-side substrate, a step of forming a SiC epitaxial layer on the surface thereof, and a step of transferring A step of forming an oxide film layer 14 on a surface layer of at least one substrate using a silicon substrate as the side substrate 15, and after the step, bonding the transfer-side substrate and the transfer-side substrate via an oxide film layer Heat treating; and separating the bonded substrate, etching the silicon substrate as the transfer-side substrate, and forming a strained silicon layer 16 on the exposed surface of the SiC epitaxial layer 13. . [Selection diagram] Fig. 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9966452-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008041830-A
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priorityDate 2003-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.