| abstract |
Provided is an adhesive composition which is halogen-free and has excellent heat resistance, folding resistance, electrical insulating properties, and handling properties in a coverlay or adhesive film state. (A) An epoxy resin obtained by glycidylating a polyfunctional resin having a biphenyl and phenol skeleton represented by the following formula: (B) a curing agent, (C) a curing accelerator, (D) a synthetic rubber, (E) a phenoxy resin having a weight average molecular weight of 5,000 to 100,000, (F) a phosphazene compound, and (G) an inorganic filler as essential components, A halogen-free flame-retardant adhesive composition characterized in that the phenoxy resin has a biphenyl skeleton or a bisphenol F skeleton, and an FPC, a copper-clad laminate for FPC, a coverlay and an adhesive using the above composition. Film. [Selection diagram] None |