| abstract |
PROBLEM TO BE SOLVED: To provide a thick-film adhesive member capable of securing a good stress relaxation property and a package height in a μBGA structure, and to secure a good chip lamination property and a good wire bonding property in a stacked CSP. An object is to provide an adhesive member. SOLUTION: The present invention provides an adhesive member having an adhesive layer and having a total thickness of 150 μm or more for a chip stack type chip size package. |