| abstract |
An object of the present invention is to obtain a positive photosensitive resin composition which is excellent in resolution and thermal shock resistance, and which can obtain a cured product having good adhesion. A positive photosensitive resin composition is obtained by copolymerizing a copolymer (A) represented by the general formula (1), a compound (B) having a quinonediazide group, and alkyl etherification of at least two or more in a molecule. Characterized in that it contains a compound (C) containing an amino group, a heat-sensitive acid generator (D) and an organic solvent (E). (X) m1- (Y) n- (X) m2 (1) (X is a structural unit containing the structural unit represented by the following formula (2) in an amount of 10% by weight or more, In the formula, R represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. Y is a structural unit derived from a carbon-carbon double bond compound such that the glass transition temperature (Tg) of the (co) polymer having Y as a structural unit is 0 ° C. or less. [Selection diagram] None |