| abstract |
The present invention provides an epoxy resin composition for sealing electronic parts, which gives a cured product exhibiting a low water absorption and has excellent moldability. An alicyclic epoxy compound (a) represented by the following general formula (1) and a curing agent (b) are essential components, and if necessary, a curing accelerator (c) and an inorganic filler (d) ) And another epoxy resin (e). Embedded image (In the formula, R 1 to R 18 may be the same or different. These have a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or a substituent. Is an alkoxy group which may be substituted.) [Selection diagram] None |