| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2016-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ab1a1249519ce7d8f09b0ce6f788fc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08d1f34efdcec5c0bd059121cb8e6207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d46ba4b12e360dff358f438cfb0b5444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_815dd96aa12ccdc93519d587b3a77d31 |
| publicationDate |
2017-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3147329-A1 |
| titleOfInvention |
Heat-curable silicone resin composition, optical semiconductor device and semiconductior package using molded product of same |
| abstract |
Provided are a heat-curable silicone resin composition capable of forming a cured product having a superior long-term reliability and a low-warpage property; an optical semiconductor device and a semiconductor package each having the cured product of such composition that is obtained in compression molding. The heat-curable silicone resin composition contains a molten mixture of a resinous organopolysiloxane (A) and an organopolysiloxane (B); an inorganic filler(C); a curing catalyst (D); and a silane coupling agent (E). The components (A) and (B) are cured by a condensation reaction, and a difference between a storage elastic modulus of a cured product of the composition at 25°C and a storage elastic modulus of a cured product of the composition at 150°C is not larger than 4,000 MPa. |
| priorityDate |
2015-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |