| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ed3d9b68c7a27b6f8be5ee422cdcca4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B26-0841 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B26-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate |
2002-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c00b5b25c0e854c7cd96cb689ad6d970
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cfd8fe5c76715106d3a8b949b9c19dd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18b7d3bfdbecc027bf066300d7075bca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f93f2fa28d2b2a5aae29cf3d9b5f9d4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8364cc88ff504e9d7223666843ed8b5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e9cb1c3d00d637a0d821ac5fdc1b827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b818dcf233fd96e7232b1e69cdd2ba0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f69e4ac4b10361e0ac99d17a1a27ade |
| publicationDate |
2004-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004145032-A |
| titleOfInvention |
Manufacturing method of microstructure |
| abstract |
An object of the present invention is to provide a method for manufacturing a microstructure having a thin portion formed with high precision in a thickness dimension. A pattern including a first conductor layer, a second conductor layer, a third conductor layer, and a portion for masking a thin portion processed into a thin portion in the second conductor layer. A first insulating layer 104 having a shape and interposed between the first conductor layer 101 and the second conductor layer 102, and a second pattern having a pattern shape including a thin portion in the second conductor layer 102 in a mask region. From the side of the first conductive layer 101 of the material substrate having a laminated structure including the second insulating layer 105 interposed between the conductive layer 102 and the third conductive layer 103, a portion corresponding to the thin portion is defined as a non-mask region. (B) of forming a thin portion by performing an etching process up to the second insulating layer 105 via the mask pattern 58 included in the step (b). [Selection] Fig. 21 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013127633-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101437193-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010512548-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4812139-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8142670-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014085409-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008539666-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4573664-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006224224-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008292703-A |
| priorityDate |
2002-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |