| abstract |
The present invention provides a photosensitive resin composition having excellent chemical resistance and good adhesion and resolution, and a method for producing a photosensitive element, a resist pattern, and a printed wiring board using the same. According to the present invention, there is provided a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein (B1) is used as the component (B). A) A photosensitive resin composition containing an ethoxylated glycerin tri (meth) acrylate compound and (B2) a bisphenol A-based (meth) acrylate compound, and a resist layer comprising the photosensitive resin composition layer are formed on a support. A photosensitive element is provided. Further, according to the present invention, there are provided a method for producing a resist pattern and a method for producing a printed wiring board using the above photosensitive resin composition or photosensitive element. [Selection diagram] Fig. 1 |