| abstract |
(57) [Abstract] (Modified) [Problem] Photosensitivity, resolution, chemical resistance (plating resistance), Provided are a photosensitive resin composition having excellent adhesion, mechanical strength and flexibility, and a method for producing a resist pattern. (A) A binder polymer having a water absorption of less than 4% by weight and a dispersity of 1.0 to 6.0, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in a molecule containing 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane as an essential component; C) A photosensitive element comprising a photosensitive resin composition containing a photopolymerization initiator is laminated on a circuit-forming substrate so that the photosensitive resin composition layer is in close contact with the photosensitive element, and is exposed and developed. A method of manufacturing a printed wiring board, comprising: etching or plating a circuit forming substrate on which a resist pattern has been manufactured. |