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filingDate 2002-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cd393348be700b936a3beb3db65aa72
publicationDate 2004-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004079770-A
titleOfInvention Insulated gate field effect transistor, method of manufacturing the same, solid-state imaging device, and method of manufacturing the same
abstract Provided are an insulated gate field effect transistor that suppresses the occurrence of a shutter step and suppresses the occurrence of punch-through and injection, a solid-state imaging device using the same, and a method of manufacturing the same. An insulated gate field effect transistor in which a gate electrode is formed on a semiconductor substrate via a gate insulating film, and a source region and a drain region are formed in the semiconductor substrate on both sides of the gate electrode. 30, a P-type first diffusion layer 12 formed on the semiconductor substrate 11 at a position deeper than the source region 33 and the drain region 34; and a semiconductor substrate 11 formed at a position deeper than the first diffusion layer 12 on the semiconductor substrate 11. And a P-type second diffusion layer 13 having a higher concentration than the first diffusion layer 12 and constituting an output circuit of a solid-state imaging device. Some or all can be used. [Selection diagram] Fig. 1
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