| abstract |
An organic solvent having excellent elasticity and adhesive strength, and further having improved storage stability by a specific alkoxysilane, can be easily peeled without destruction of a material only by heating when an adhesive member is unnecessary, and an organic solvent. An adhesive which does not use any of them, and a laminate which can be peeled off by heating using the same. SOLUTION: 100 parts by mass of a moisture-curable polymer (A), A heat-peelable laminate comprising a heat-peelable moisture-curable polymer adhesive containing 15 to 60 parts by mass of a thermally expandable fine hollow particle (B). [Selection diagram] None |