| abstract |
A porous organosilica glass film having low dielectric constant and improved mechanical properties, thermal stability and chemical resistance. A formula Si v O w C x H y F z ( where, v + w + x + y + z = 100%, v is from 10 to 35 atomic%, w is from 10 to 65 atomic%, x is from 5 to 30 atomic%, y is 10 to 50 atomic% and z is 0 to 15 atomic%). A gaseous reagent containing a precursor selected from the group consisting of organosilanes and organosiloxanes and a porogen is introduced into a vacuum chamber, energy is applied to the gaseous reagent, a reaction of the gaseous reagent occurs, and a preliminary Deposit the film. The preliminary membrane has pores and substantially all of the porogen is removed to obtain a porous membrane with a dielectric constant less than 2.6. [Selection diagram] Fig. 1 |