http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003338669-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f8309d48a8f9bc57aa3573d84ace568f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2002-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ce92512547ba3b321859a1a9a1b6f03 |
| publicationDate | 2003-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003338669-A |
| titleOfInvention | Wiring board, its manufacturing method and measuring device |
| abstract | PROBLEM TO BE SOLVED: To provide a wiring board having a uniform height and a high hardness as a metal projection connected to a wiring film, and a long life, each electrode and an electrode of an object to be measured using the wiring board. Provided is a measuring device having high uniformity of load at the time of pressurization and small variation in electrical conductivity. A surface 21 of a metal plate 21 for forming projections is provided. a, a wiring film 23 is formed by electrolytic plating, and thereafter, Surface 21 a of metal plate 21 for forming projections on wiring film 23 side Then, a rigid base material 25 is laminated via a buffer layer 24 to integrate the projection-forming metal plate 21, the buffer layer 24 and the base material 25, and then the projection-forming metal plate 21 is selectively removed. By etching, metal projections 27 connected to the wiring film 23 at the bottom surface are formed, and a wiring substrate forming the base 29 of the bare die carrier is manufactured. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010232339-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006028238-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006028238-A1 |
| priorityDate | 2002-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID516892 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453034310 |
Total number of triples: 24.