http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003282451-A

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filingDate 2002-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79a32ac971c8e16cf7b72a2d38c4fa1d
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publicationDate 2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003282451-A
titleOfInvention Preparation method of SiC single crystal thin film
abstract PROBLEM TO BE SOLVED: To provide a method for producing a high quality SiC single crystal thin film by homoepitaxially growing a single crystal of SiC at a low growth temperature. SOLUTION: On a substrate including a single crystal silicon carbide (SiC) region, plasma enhanced chemical vapor deposition (plasma CVD) is performed. This is a method for producing a SiC single crystal thin film in which a SiC single crystal is homoepitaxially grown at 800 to 1200 ° C. In particular, use of high-density, high-energy plasma generated by plasma using a microwave, an atomic supply ratio of carbon and silicon (C / Si ratio) of 100 or more, and a supplied silicon atom concentration of 100 mol. It is preferable that the growth be performed at a ppm or less.
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