| abstract |
(57) Abstract: Provided is a printed wiring board having a small amount of attenuation at a high frequency of a conductive line in a surface layer portion. A printed wiring board (1) including a dielectric layer (11) and a conductive line (20) provided on a surface portion of the dielectric layer (11), wherein the conductive line (20) includes a Cu wiring as an underlayer, Al and Ag. And a surface portion 16 made of one or more metals selected from the group consisting of Au. Further, the dielectric layer 11 contains silica particles, glass cloth, and one or more polymers selected from the group consisting of polybutadiene, polyisoprene, a copolymer containing butadiene, and a copolymer containing isoprene. A composition. |