| abstract |
(57) [Abstract] [Problem] To improve high-frequency characteristics, reduce the size, and reduce the price. SOLUTION: A plurality of unit wiring layers each including an insulating layer partially having a passive element portion and the like and a pattern wiring are formed by being laminated on a dummy substrate and peeled off from the dummy substrate, and each unit wiring layer is formed. A high-frequency circuit block body 2 in which a main surface of a wiring layer is flattened is mounted on a mother substrate 3, and a passive element portion and a pattern formed on the main surface of each unit wiring layer in the high-frequency circuit block body Wiring can be formed with high accuracy, and high-frequency characteristics are improved. In addition, since the high-frequency circuit block 2 does not require a base substrate, downsizing and cost reduction can be achieved. |