http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003110105-A

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publicationDate 2003-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003110105-A
titleOfInvention Semiconductor device and method of manufacturing the same
abstract (57) [Summary] [PROBLEMS] To realize a fully depleted operation and suppress a decrease in threshold voltage. The semiconductor device includes a first insulating layer, a semiconductor layer formed on the upper surface of the first insulating layer, and a second insulating layer formed on the upper surface of the semiconductor layer. The semiconductor layer has channel regions 5 and 6 and source / drain regions 3 formed in regions outside the channel regions 5 and 6. The channel region includes a low-concentration region 5 and a high-concentration region 6 formed in a region outside the low-concentration region 5 and having an impurity concentration higher than that of the low-concentration region 5. It is essentially important that the width of the high concentration region 6 is 30 nm or less. The width of the high concentration region 6 is 30 nm If it is less than or equal to, the operation of the complete depletion type is realized, and the decrease in the threshold voltage is suppressed. If the impurity concentration of the high-concentration region 6 is lower than 1/10 of the impurity concentration at the end of the source / drain region at a position 30 nm inside the end of the source / drain region, the complete depletion type operation is more effectively realized, In addition, a decrease in the threshold voltage is more effectively suppressed.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008166724-A
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