| abstract |
(57) [Problem] To remove both particle contamination and metal contamination in a short time in the cleaning of a substrate, and in this case, problems such as re-adhesion of contamination and a change in processing dimensions due to etching are extremely reduced. To provide a highly efficient substrate cleaning method. A method for cleaning a substrate surface, comprising at least the following steps (1) and (2), wherein the step (1) is performed and then the step (2) is performed. Step (1) A cleaning step of cleaning the substrate surface with a complexing agent-containing alkaline cleaning agent. Step (2): using a cleaning agent having a hydrofluoric acid content C (% by weight) of 0.03 to 3% by weight, a cleaning time t (second) of the substrate with the cleaning agent being 45 seconds or less, and t is 0.25 A washing process in a relationship of ≦ tC 1.29 ≦ 5. |