http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003064240-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34cec11e5fd47d140b3570ac08a7353c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43a0ac9627f39fb4aaf5c5f56ce49479 |
| publicationDate | 2003-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003064240-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation and a semiconductor device, which has a high dielectric constant in a high frequency region, a good resin fluidity, and enables a thinning of a high frequency semiconductor device. SOLUTION: (A) an epoxy resin, (B) a curing agent, In the epoxy resin composition containing (C) a ceramic powder and (D) a curing accelerator as an essential component, the (C) ceramic powder is a ceramic powder having a dielectric constant of 50 to 30,000, and is contained in the total epoxy resin composition. 90 vol% And a semiconductor device sealed with a cured product thereof. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008013694-A |
| priorityDate | 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.