| abstract |
(57) Abstract: The object of the present invention is to provide high heat resistance at a high temperature, a high elastic modulus at a high temperature, and a thermal expansion especially with a semiconductor element when combined with a specific inorganic filler. An object of the present invention is to provide an epoxy resin composite material in which cracks and peeling are less likely to occur due to a small difference in coefficient between room temperature and high temperature, and a resin sealing material, a resin sealing semiconductor device and a multilayer wiring board using the same. An epoxy resin and a specific organosilicon compound represented by the general formula (1) or (2) shown in the text (where R is an organic group containing a functional group that causes an addition reaction with a curing agent of the epoxy resin) And R ', R ", R ′ ″, R ″ ″, R ″ ″ ″ and R ″ ″ ″ are SiRO 3/2 Is a silicon-containing group having 0 to 3 repeating units. When the number of SiRO 3/2 is 0, R ′, R ″, R ''',R'''',R''''' and R '''''' is H, CH 3 and the One of C 2 H 5 . ), And a thermosetting resin composition containing a curing agent for the epoxy resin and a specific inorganic filler. |