| abstract |
PROBLEM TO BE SOLVED: To provide a new heat-resistant, halogen-free flame retardant without impairing the excellent adhesiveness, flexibility, and various electrical properties of a conventional adhesive composition. Adhesive composition, To provide a flexible printed wiring board and a coverlay film using the adhesive. SOLUTION: The adhesive composition comprises the following A) to F) and has a total phosphorus content of 0.5 to 2.5% by weight. A) polyimide siloxane, B) epoxy resin, C) phenolic resin, D) copolymer obtained by reacting aromatic polymer with organopolysiloxane, E) reactive phosphorus-containing compound, F) curing accelerator . |