| abstract |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a two-layer printed circuit board by bonding a metal layer to a resin substrate such as polyimide without using an adhesive. SOLUTION: A metal ion accelerated on the surface of a flexible resin substrate is driven into a plasma-assisted atmosphere after the degree of vacuum in the ion plating apparatus is set to 10 -4 torr or more, and the molecular bonding of the resin substrate is started. By dissociating, the ratio of the metal component and the component forming the resin substrate such as carbon, the intermediate layer having the property as a gradient material that changes continuously is formed with a thickness of at least 0.1 μm. Bonded to the resin substrate material on the surface where the ratio is high, and adhered by forming the metal layer on the base with the metal implanted on the surface where the ratio of the metal component is high by wet or dry plating, evaporation, etc. A method for producing a conductive flexible film without using an agent. |