| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02348
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-46 |
| filingDate |
2001-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_249134be689cbc0d3642d044031f18d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7724e2a6076727d924cdafb80784f8cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b95d92741b15becda2b0f503825f0fd7 |
| publicationDate |
2003-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003031566-A |
| titleOfInvention |
Composition for forming low dielectric constant insulating film, method for forming insulating film using the same, and electronic component having insulating film obtained thereby |
| abstract |
PROBLEM TO BE SOLVED: To provide a composition suitable for forming a low dielectric constant insulating film useful in electronic components, a method for forming a low dielectric constant insulating film from the composition, and a method for forming the same. Electronic components having a low dielectric constant insulating film. SOLUTION: A composition containing a low dielectric constant polymer material and a sublimable substance dissolved in a solvent, a film is formed on a substrate from the composition, and then the sublimable substance is removed from the film to obtain a low dielectric substance. An insulating film is formed. A preferred low dielectric constant polymer material is a polyaryl ether, and a preferred sublimable substance is a silicone compound having a closed tertiary structure having a silicon atom at its apex, such as Si-T8. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7932295-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7399715-B2 |
| priorityDate |
2001-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |