| abstract |
(57) Abstract: A barrier layer between a lower bump metal and a solder bump is improved. A method of manufacturing a solder bump on a semiconductor wafer provided with a metal bonding pad (4) includes: (a) forming a metal bonding / barrier / electroplating bus layer 8 at least on the bonding pad; (B) forming the resist layer 10 in a predetermined pattern defining an opening on the bonding pad 4; (c) forming the solder wettable layer 12 in the opening; A part of the resist is removed from the region, and the edge of the solder wettable metal layer 12 and the resist 10 are removed. And (e) on the solder wettable metal layer 12 including the gap formed in the step (d), Forming a barrier metal layer for sealing the solder wettable metal layer, (f) assembling a solder bump on the barrier metal layer, and (g) removing a resist material; (H) removing the exposed adhesive / barrier layer. |